vivo X70 Pro Plus leaks: Expect a unique camera hump (Updated: launch date)

Update: August 30, 2021 (2:27 AM ET): vivo’s X70 series leaked last week, and the Chinese manufacturer has now announced a September 9 launch date in its home market. Check out the official image posted on Weibo below.

It’s unclear if all three devices (standard, Pro, Plus) will debut here or if this will be a global launch as well. Nevertheless, vivo has confirmed that the phones will be equipped with the company’s first in-house imaging chip.

Original article: August 26, 2021 (6:55 AM ET): Earlier this week renders of the upcoming vivo X70 Pro broke cover. Now, a new set of leaks and renders relating to the vivo X70 Pro Plus have emerged.

The details stem from Pricebaba and tipster Steve Hemmerstoffer and provide more insight into the phone’s core specs and overall design.

Let’s talk about that design. Up front, the vivo X70 Pro Plus wears a large 6.7-inch curved AMOLED display with a punch hole camera. It seems reasonable not to include an under-display camera as a phone series that privileges camera performance over aesthetics.

Speaking of which, a sizeable camera hump is visible at the rear, showcasing three sensors in a vertical line and another to the right of the bottom lens. There’s highly apparent ZEISS branding at the rear, too. Overall, the hump is 2.3mm thick and adds to the already chunky 9mm of the phone itself. The vivo X70 Pro Plus is also said to measure 164.8mm long and 75.5mm wide. Akin to the Xiaomi Mi 11 Ultra, the camera bump’s accent extends across the top third of the phone. There’s no indication of a second screen, though.

The right-hand side of the device packs a power button and a volume rocker, while the bottom houses a single speaker grille and USB-C port.

The renders don’t reveal much in the way of specs, but the phone is believed to sport a Snapdragon 888 SoC, at least 8GB of RAM, and a Full HD+ screen resolution.